Addressing the full-process needs of semiconductor wafer manufacturing, core process equipment, device packaging, and backend processing, we deliver core component solutions featuring high stability, high temperature resistance, plasma corrosion resistance, efficient heat dissipation, and high precision. Fully compatible with both mature and advanced process nodes for high-end semiconductor equipment, our solutions balance performance and cost advantages, supporting the semiconductor industry's progress toward greater precision, efficiency, and long-term reliability.
By embedding metal electrodes inside ceramics and performing co-sintering, electrostatic chucks and ceramic heaters can be manufactured.
Leveraging various material technologies, we have developed a series of electrostatic chucks and ceramic heaters that meet customer requirements. Whether in plasma environments, electron beam applications, or other fields, we can provide products tailored to specific application needs from the development and trial manufacturing stag
By pre-embedding metal electrodes inside ceramics and forming them through integrated sinter bonding, we have developed a series of electrostatic chucks and ceramic heaters that can stably adapt to harsh conditions such as plasma environments and electron beam applications. From the development and trial manufacturing stages, we can deliver customized products that meet customer application requirements.
| Parameter | Value |
| Dimensions | Customized on demand |
| Thickness | Customized as required |
| Dielectric Constant | Application-adapted |
| Density | 3.7-3.9 g/cm³ |
| Surface Roughness | Custom per drawing |
Address
No. 2567, Antai 2nd Road, Xishan District, Wuxi, Jiangsu, China
Tel
Add: No. 2567, Antai 2nd Road, Xishan District, Wuxi, Jiangsu, China
Add: Dongtai High-tech Zone, Dongtai, Yancheng, Jiangsu, China
