Semiconductor Manufacturing

In semiconductor processing equipment, the core components that hold and secure wafers must integrate temperature-controlled heating functionality, imposing stringent requirements on material properties. They need to possess ultra-high thermal conductivity for precise and uniform wafer temperature control; closely match the coefficient of thermal expansion (CTE) of silicon wafers to ensure that ultra-thin and large-diameter wafers remain stress-free and distortion-free during high-low temperature cycles; and simultaneously provide high electrical insulation, resistance to plasma bombardment, and long-term resistance to highly corrosive process gases. These properties are critical determinants of process stability and chip yield.
With our material systems and precision engineering, we overcome these core challenges with targeted solutions, continuously empowering semiconductor equipment with enhanced performance and process efficiency.