During the manufacturing process of LCD/OLED/MiniLED panels, large-size glass substrates require non-contact, stress-free clamping, while maintaining high flatness, high alignment accuracy, and process stability, and must operate reliably under harsh conditions such as vacuum, plasma, and high temperatures.
Ceramic-based electrostatic chucks have been widely used in key process equipment including thin film deposition (PVD/CVD), photolithography, etching, cleaning, and surface treatment.
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